CM1263 ? 06DE
PACKAGE DIMENSIONS
UDFN12, 2.5x1.35, 0.4P
CASE 517BD
ISSUE O
2X
0.10 C
PIN ONE
REFERENCE
D
A
B
E
L1
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
OPTIONAL
CONSTRUCTION
12X
2X
0.10 C
0.05 C
0.05 C
NOTE 4
TOP VIEW
DETAIL B
SIDE VIEW
A
A1
(A3)
C
SEATING
PLANE
A1
DETAIL B
EXPOSED Cu MOLD CMPD
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN MAX
0.45 0.55
0.00 0.05
0.13 REF
0.15 0.25
2.50 BSC
1.90 2.10
1.35 BSC
0.30 0.50
0.40 BSC
0.15 ???
0.20 0.30
??? 0.05
12X
L
1
D2
6
DETAIL A
E2
RECOMMENDED
SOLDERING FOOTPRINT*
K
12
e
7
12X
b
0.10 C A B
PACKAGE
OUTLINE
2.20
12X
0.40
BOTTOM VIEW
0.05 C
NOTE 3
1.55
0.50
0.40
PITCH
12X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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CM1263 ? 06DE/D
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